GEL EASY PRINT
A ``No Clean'' type paste is designed for gluing SMD components in production processes that do not include the washing phase;In addition to metal powders |
the product composition includes resin-based and flux-based solvent |
activators which removes oxides and thixotropic additions |
responsible for viscosity and plasticity;The paste does not lose its physical and chemical properties even after being left for 20 hours on the PCB;This time depends on the conditions in the room: humidity and temperature . |
(SN96.5 |
AG3 |
CU0.5) |
Additional properties of the paste: |
- Does not contain chlorides |
- The residue flow neither corrodes nor requires washing |
- Welded joints have good mechanical and electrical properties. |
Packaging: blister 1 pc. |